Metal Powders
- Cu Powder/Flake, Ag Powder/Flake, Solder Powder
- Ag-Coated Cu Powder, Ceramic-Coated, Cu Powder
- Si-Powder/Cake
- Ni Powder
Molding Encapsulants & process Aids
- EMC: Tablet / Powder / Sheet / Liquid Form
- Cleaning & Releasing Compound
- Non-Woven Fabric Liner
- QFN Back Tape, PI-Tape
- Cleaning & Waxing Rubber Sheet
FPC & PCB Process Materials
- PI Film, Carrier Film, 2L-FCCL
- Solder Mask, PSPI Cover Ink
- Ti Anode Plate for Cu Foil
EMI Shielding Applications
- Functionalized Graphene, Insulation Carbon Paste
- Crystalline/ Amorphous Magnetic Powder
Process Equipments & Machining Service
- Pico Sec Laser Machine
- Laser Cutting, Grooving & Drilling Service
