Molding Encapsulants & process Aids
- EMC: Tablet / Powder / Sheet / Liquid Form
- Cleaning & Releasing Compound
- Non-Woven Fabric Liner
- Laser Mold Cleaning Machine
- Cleaning & Waxing Rubber Sheet
- Releasing Film
Metal Powders, Paste
- Cu Powder/Flake, Ag Powder/Flake, Solder Powder
- Ag-Coated Cu Powder, Ceramic-Coated, Cu Powder
- Si-Powder/Cake
- Ni Powder, Ag Nano Powder
- Rare Earth Metal & Compounds
- Glass Frit for MLCC /Solar Cell/ LTCC
FCCL , FPC , PCB Process Materials & Tools
- PI Film, Carrier Film, 2L-FCCL
- LCP Film, Powder, Varnish
- Solder Mask, PSPI Cover Ink
- Releasing PET Film / Paper /TPX
- Ti Anode Plate for Cu Foil, Nano Pd Solution
- Low Df Glass Fabrics
- Cutting Blade & Knife
EMI Shielding Applications
- Functionalized Graphene, Insulation Carbon Paste
- Ag-Coatd Cu Powder
Process Equipments & Machining Service
- Cutting Blade & Knife
- Laser Cutting, Grooving & Drilling Service
- Pre-Molded Lead Frame & Array Lead Frame
- Metal-Post Substrates & Routable Lead Frame
